60/40 Sn/Pb (Tin/Lead) Bond Core Solder Wire 20 SWG (0.914mm) 250gm ACS712-30 Hall-Effect-Based Sensor IC 5V 30A 32-lead TQFP

32-lead TQFP

It has a data retention of 20 years at 85 °C/ 100 years at 25 °C

Suitable for LTE and GSM networks

Brown for these 820K resistors

This is the TLP626-2 IC optocoupler manufactured by Toshiba

60/40 Sn/Pb (Tin/Lead) Bond Core Solder Wire 20 SWG (0.914mm) 250gm ACS712-30 Hall-Effect-Based Sensor IC 5V 30A 32-lead TQFPThis is a single core flux solder wire which is 250 grams in weight. It has a conductive alloy with a low melting point. It can be melted using a soldering iron. The melted solder material is used to solder the components or wires. The 60 40 Tin Lead alloy solder is the best for Applications like fine electrical soldering. Features: High quality solder wire High activity flux makes more reliable soldering and leaves bright shiny solder joints after